Surface defect inspection on wafers is a critical step in the semiconductor manufacturing process. Utilizing high-precision optical imaging technology, small defects such as particles, cracks, scratches, etc. on the wafer surface are identified through image analysis for real-time monitoring of process stability. It is also used for wafer shipment inspection. Ensure the quality of product shipments.
VPTek Tornado series wafer surface defect inspection equipment, suitable for FAB wafer manufacturing IDM, defect inspection and critical dimension measurement in advanced packaging.
Tornado 2000
Tornado 2000 is a wafer fully automatic optical inspection equipment launched by VPtek for sub micro level precision. Based on advanced dual path optical imaging system and multiple lighting schemes, it adapts to optical imaging problems of various materials and supports D2D, D2G, C2C, D2DB, AI and other inspection modes. It can be used for defect inspection of large-sized DIE and non array layout wafers. Tornado 2000 is based on flexible software and hardware configuration and can be applied to defect inspection in the front and back processes. It has significant advantages such as flexibility, ease of use, high efficiency, and low cost.
Application scenarios
Surface 2D and 3D defect inspection for 4, 6, 8-inch wafer front, middle, back, and advanced packaging processes.
Key Features
- Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
- Dual Port cyclic loading and unloading reduces operator waiting time
- Supports bright and dark field illumination to better capture subtle defects
- Support multiple automatic focusing modes in hardware, software, and fitting to ensure the inspection accuracy of large warped wafers
- Support partition inspection with multiple ROIs and layers
- Support D2D D2G、D2DB inspection algorithm
- Support AI defect inspection and classification
- Support data integration with customer MES systems
Tornado 2100
Tornado 2100 is a fully automated optical key dimension and etching measurement device launched by VIP for wafers. Based on a high-resolution optical imaging system, it further enhances graphic contrast and reduces transition pixels. Paired with a high-performance motion table, it improves the positioning efficiency during the measurement process, reduces steady-state jitter, and meets the demanding requirements of measurement repeatability. The Tornado 2100 can be used for measuring critical dimensions and etching accuracy in the preceding process.
Application scenarios
Measurement of key dimensions and etching accuracy for 4, 6, and 8-inch wafers in the front track.
Key Features
- Compatible with 4, 6, and 8-inch wafers simultaneously, flexible and convenient
- Support automatic measurement based on Recipe
- Support multiple wavelength lighting and optical systems including white light, RGB, and UV
- Support multiple line width measurement methods such as grayscale threshold, grayscale change rate, and line fitting
- Multi hold non-linear compensation function
- Support line width measurement under low contrast conditions
Tornado 3000
Tornado 3000 is a fully automatic optical inspection equipment launched by VPtek for wafers with sub micron precision of 8 and 12 inches. Based on the mature architecture of Tornado 2000, the imaging resolution of the optical system is continuously improved through further upgrading and optimization of the optical system to meet more stringent process requirements.
Application scenarios
2D and 3D defect inspection for 8 and 12 inch wafer front, middle, and advanced packaging processes.
Key Features
- Supports feeding methods such as 8-inch SMIF, 12 inch FOUP, and Open Cassette
- Dual light path array+area array imaging system, fast scanning
- UV based optical system can better capture subtle defects
- Support hardware, software, and fitting multiple automatic focusing modes to ensure the inspection accuracy of large warped wafers
- Support partition inspection with multiple ROIs and layers
- Support D2D, D2G, D2DB inspection algorithms
- Support AI defect inspection and classification
- Support data integration with customer MES systems
